View UPD168102K9-5B4_4294705.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

mos integrated circuit pd168102 monolithic 6-channel h bridge driver data sheet document no. s15301ej1v0ds00 (1st edition) date published april 2002 n cp(k) printed in japan ? 2002 the information in this document is subject to change without notice. before using this document, please confirm that this is the latest version. not all devices/types available in every country. please check with local nec representative for availability and additional information. description the pd168102 is a monolithic 6-channel h bridge driver ic consisting of a cmos controller and a mos output stage. because it uses a mos process, this driver ic consumes less current and loses less voltage at the output stage than conventional driver ics that use bipolar transistors. in addition, the pd168102 employs p-channel mosfets in its output stage, eliminating the need for an on-chip the charge pump circuit. therefore, the current consumption during circuit operation can be significantly reduced. of the six output channels, four channels are voltage drive type and two channels are current drive type (voltage drive is also possible). the current drive method of the pd168102 is the output chopping method, which realizes lower power consumption drive than the conventional high-power-dissipation linear drive method. the pd168102 is housed in a 48-pin wqfn to decrease the mounting area and height. the pd168102 can simultaneously drive two stepper motors and two dc motors and is ideal for the motor driver of digital still cameras. features { six h bridge circuits employing power mosfets { voltage drive type: 4 channels, current drive type (constant current chopping type): 2 channels { low current consumption due to elimination of charge pump circuit { input logic frequency: 100 khz supported { 3 v power supply supported minimum operating supply voltage: 2.5 v { low voltage malfunction prevention circuit internal circuit shutdown at v dd < 2.5 v { on-chip overheat protection circuit { 48-pin wqfn (7 mm 7 mm) ordering information part number package pd168102k9-5b4 48-pin plastic wqfn (7 mm 7 mm)
data sheet s15301ej1v0ds pd168102 2 pin functions package: 48-pin wqfn (7 mm 7 mm) pin no. pin name pin function 1 brksel stop mode switching pin when output open 2v dd control block power supply pin 3 pgnd output gnd pin 4out 1b ch 1 output pin 5v m1 ch 1 output block power supply pin 6out 1a ch 1 output pin 7 pgnd output block gnd pin 8out 2b ch 2 output pin 9v m2 ch 2 output block power supply pin 10 out 2a ch 2 output pin 11 pgnd output block gnd pin 12 dgnd control block gnd pin 13 i sen5 ch 5 current sense signal input pin 14 cl 5 ch 5 reference voltage input pin 15 v m5 ch 5 output block power supply pin 16 out 5b ch 5 output pin 17 rf 5 ch 5 sense resistor connection pin 18 out 5a ch 5 output pin 19 v m5 ch 5 output block power supply pin 20 v m6 ch 6 output block power supply pin 21 out 6b ch 6 output pin 22 rf 6 ch 6 sense resistor connection pin 23 out 6a ch 6 output pin 24 v m6 ch 6 output block power supply pin 25 cl 6 ch 6 reference voltage input pin 26 i sen6 ch 6 current sense signal input pin 27 pgnd output block gnd pin 28 out 3a ch 3 output pin 29 v m3 ch 3 output block power supply pin 30 out 3b ch 3 output pin 31 pgnd output block gnd pin 32 out 4a ch 4 output pin 33 v m4 ch 4 output block power supply pin 34 out 4b ch 4 output pin 35 pgnd output block gnd pin 36 visel voltage/current control switching pin (ch 5, ch 6) 37 in 12 ch 6 input pin 38 in 11 ch 6 input pin 39 in 10 ch 5 input pin 40 in 9 ch 5 input pin 41 in 8 ch 4 input pin 42 in 7 ch 4 input pin 43 in 6 ch 3 input pin 44 in 5 ch 3 input pin 45 in 4 ch 2 input pin 46 in 3 ch 2 input pin 47 in 2 ch 1 input pin 48 in 1 ch 1 input pin caution multiple pins with the same function must all be connected.
data sheet s15301ej1v0ds 3 pd168102 block diagram 1 2 3 4 5 6 7 8 9 10 11 12 brksel v dd pgnd out 1b v m1 out 1a pgnd out 2b v m2 out 1a pgnd dgnd 48 36 35 34 33 32 31 30 29 28 27 26 25 visel pgnd out 4b v m4 out 4a pgnd out 3b v m3 out 3a pgnd i sen6 cl 6 47 46 45 44 43 42 41 40 39 38 37 in 1 in 2 in 3 in 4 in 5 in 6 in 7 in 8 in 9 in 10 in 11 in 12 13 14 15 16 17 18 19 20 21 22 23 24 i sen5 cl 6 v m5 out 5b rf 5 out 5a v m5 v m6 out 6b rf 6 out 6a v m6 ch 1 controller ch 2 controller ch 3 controller ch 5 controller ch 6 controller tsd uvlo ch 4 controller ch 5 controller ch 6 controller ch 1 h bridge circuit ch 2 h bridge circuit ch 5 h bridge circuit ch 3 h bridge circuit ch 6 h bridge circuit cmp5 cmp6 ch 4 h bridge circuit caution multiple pins with the same function must all be connected. the motor power supply pins v m1 and v m2 , and v m3 and v m4 are internally connected, so be sure to apply the same potential to them.
data sheet s15301ej1v0ds pd168102 4 example of standard connection 3 v reg 10 f m m m m cpu 2.7 v to 5.5 v 22 f 330 pf 330 pf 1 k ? 1 k ? 1.5 ? 1.5 ? 1 2 3 4 5 6 7 8 9 10 11 12 brksel v dd pgnd out 1b v m1 out 1a pgnd out 2b v m2 out 1a pgnd dgnd 48 36 35 34 33 32 31 30 29 28 27 26 25 visel pgnd out 4b v m4 out 4a pgnd out 3b v m3 out 3a pgnd i sen6 cl 6 47 46 45 44 43 42 41 40 39 38 37 in 1 in 2 in 3 in 4 in 5 in 6 in 7 in 8 in 9 in 10 in 11 in 12 13 14 15 16 17 18 19 20 21 22 23 24 i sen5 cl 6 v m5 out 5b rf 5 out 5a v m5 v m6 out 6b rf 6 out 6a v m6 ch 1 controller ch 2 controller ch 3 controller ch 5 controller ch 6 controller tsd uvlo ch 4 controller ch 5 controller ch 6 controller ch 1 h bridge circuit ch 2 h bridge circuit ch 5 h bridge circuit ch 3 h bridge circuit ch 6 h bridge circuit cmp5 cmp6 ch 4 h bridge circuit this circuit diagram is shown as an example of connection, and is not intended for mass production design.
data sheet s15301ej1v0ds 5 pd168102 function operation table the logic of each channel is shown in the table below. i/o truth table for channels 1 to 6 input output visel in1, 3, 5, 7, 9, 11 in2, 4, 6, 8, 10, 12 outa outb output status operating mode of ch 5 and ch 6 l l z z stopped (output open, standby) lhlhreverse (outb outa) hlhlforward (outa outb) l h h l l stopped (short brake) voltage control output l l z z stopped (output open) lhlhreverse (outb outa) hlhlforward (outa outb) h h h l l stopped (short brake) constant current chopping h: high level, l: low level, z: high impedance constant current chopping is possible for channels 5 and 6. when visel is set to high level, if the voltage becomes higher than the reference voltage (external input) and the current becomes higher than the current set by the feedback resistor, the output can be forcibly chopped. when visel is set to low level, channels 5 and 6 function in the same way as channels 1 to 4. standby function the pd168102 realizes a standby function by combining the input signals. by setting all the control input signals of channels 1 to 6 to low level, a standby mode in which the current consumption of the internal circuit is suppressed is entered. note that the output status is high impedance (output open). brksel pin function by using the logic of brksel, whether the function that prevents the motor power supply rising in the hi-z output status (input l, l) is enabled or disabled can be selected. refer to the truth table below. brksel truth table brksel function lhi-z status h regenerates output current using an internal channel. an internal timer is incorporated, through which the regeneration period is set for approx. 1 ms, and then the hi-z status is entered.
data sheet s15301ej1v0ds pd168102 6 absolute maximum ratings (t a = 25 c: mounted on glass epoxy board 100 mm 100 mm 1 mm, copper film area: 15%) parameter symbol conditions ratings unit v dd control block ? 0.5 to +6.0 supply voltage v m motor block ? 0.5 to +6.0 v input voltage v in ? 0.5 to v dd +0.5 v v out ch 1 to ch 4 6.2 output pin voltage ch 5, ch 6 5.7 v dc output current 1 (ch 1 to ch 4) i d(dc)1 dc 0.3 a/ch dc output current 2 (ch 5, ch 6) i d(dc)2 dc 0.5 a/ch instantaneous output current 1 (ch 1 to ch 4) i d(pulse)1 pw < 10 ms, duty 20% 0.6 a/ch instantaneous output current 2 (ch 5, ch 6) i d(pulse)2 pw < 10 ms, duty 20% 1.0 a/ch power consumption p t 1.0 w peak junction temperature t ch(max) 150 c storage temperature t stg ? 55 to +150 c recommended operating conditions (t a = 25 c: mounted on glass epoxy board 100 mm 100 mm 1 mm, copper film area: 15%) parameter symbol conditions min. typ. max. unit v dd control block 2.5 5.5 v supply voltage v m motor block 2.7 5.5 v v in1 0v dd v input voltage v in2 cl pin 0.1 0.5 v dc output current 1 (ch 1 to ch 4) i d(dc)1 dc ?0.2 +0.2 a/ch dc output current 2 (ch 5, ch 6) i d(dc)2 dc ?0.4 +0.4 a/ch instantaneous output current 1 (ch 1 to ch 4) i d(pulse)1 pw < 10 ms, duty 20% ?0.4 +0.4 a/ch instantaneous output current 2 (ch 5, ch 6) i d(pulse)2 pw < 10 ms, duty 20% ?0.8 +0.8 a/ch logic input frequency f in 100 khz operating temperature range t a ?10 85 c peak junction temperature t ch(max) 125 c
data sheet s15301ej1v0ds 7 pd168102 electrical specifications (unless otherwise specified, v dd = v m = 3 v, t a = 25 c) parameter symbol conditions min. typ. max. unit v dd pin current in standby mode i dd(stb) 1.0 a v dd pin current when operating i dd(act) 1.0 ma input current, high i ih v in = v dd 60 a input current, low i il v in = 0 ? 1.0 a input pull-down resistor r ind 50 200 k ? input voltage, high v ih 2.5 v v dd 5.5 v 0.7 v dd v input voltage, low v il 2.5 v v dd 5.5 v 0.3 v dd v h bridge on-resistance 1 (ch 1 to ch 4) r on1 i m = 0.2 a, sum of the top and bottom stages 1.5 2.0 ? h bridge on-resistance 2 (ch 5, ch 6) r on2 i m = 0.4 a, rf 5 , rf 6 = 0 v, sum of the top and bottom stages 1.0 1.5 ? output leakage current i m(off) per v m pin, v m = 5.5 v, all control pins are low level 10 a current detection comparator offset voltage v co v cl = 0.1 v ? 10 10 mv detection voltage at low voltage v dds 2.5 v output turn-on time t on 0.7 2.0 s output turn-off time t off r m = 20 ? , see figure 1 0.2 0.5 s all-off time at mode change t hiz 50 ns rise time t r r m = 20 ? , see figure 1 0.3 s fall time t f 0.1 s current detection comparator operation delay time t cdl v cl = 0.1 v, v isen = 0 v 0.2 v, see figure 2 0.4 1.0 s the overheat protection circuit operates at t ch > 150 c. in the overheat protected status, all outputs are high impedance. in the standby mode, the overheat protection circuit and the low-voltage malfunction prevention circuit do not operate.
data sheet s15301ej1v0ds pd168102 8 switching characteristics waveforms figure 1. h bridge switching waveform (1) in2 = low level 100 % 90 % 90 % 90 % 10 % 10 % 10 % hi-z hi-z out1a out1b v in1 i out t r t f t off t on (2) in2 = high level 100 % 90 % 90 % 90 % brake 10 % 10 % 10 % out1b out1a out1b out1a v in1 i out t f t off t r t on a high impedance period of approx. 50 ns is secured to prevent through current when switching the mode. figure 2. current detection comparator switching waveform 100 % 0 v 0.1 v 0.2 v 0 % 0 % 0 % 50 % 50 % 50 % 50 % v cl v isen i d t cdl t cdl
data sheet s15301ej1v0ds 9 pd168102 total power dissipation and operating ambient temperature characteristics p t vs. t a characteristics 1.4 0.8 1.0 1.2 1.0 w when mounted on 100 mm 100 mm 1.0 mm glass epoxy board 0.6 0.4 0.2 0 ? 20 0 25 50 75 100 125 150 operating ambient temperature t a (?c) total power dissipation p t (w) 125 ? c/w 25 ? c 85 ? c remark when the operating ambient temperature is 25 c or lower, power application up to 1 w is possible. when the operating ambient temperature is higher than 25 c, perform derating in accordance with the above figure. in addition, when at 85 c (operating ambient temperature recommended condition), power application up to 0.52 w is possible.
data sheet s15301ej1v0ds pd168102 10 characteristics curves i dd vs. v dd characteristics (v m = 3.0 v, t a = 25 ? c) supply voltage v dd (v) 1 0.8 0.6 0.4 0.2 0246 v dd pin current i dd ( a) i dd vs. t a characteristics (v dd = 5.5 v, v m = 3.0 v) v ih , v il vs. v dd characteristics (v m = 3.0 v, t a = 25 ? c) v ih , v il vs. t a characteristics (v dd = 5.5 v, v m = 3.0 v) operating ambient temperature t a ( ? c) 4 3 2 1 0 0 20 40 60 80 100 20 v dd pin current i dd ( a) supply voltage v dd (v) 5 4 3 2 1 0 2 046 high/low-level input voltage v ih , v il (v) operating ambient temperature t a ( ? c) 5 4 3 2 1 0 02040 20 60 80 100 0 20 40 60 80 100 40 0246 high/low-level input voltage v ih , v il (v) r on1 (ch 1 to ch 4) vs. v m characteristics (v dd = 3.0 v, t a = 25 ? c) motor supply voltage v m (v) 2 1.5 1 0.5 0 h bridge on-resistance r on1 ( ? ) r on1 (ch 1 to ch 4) vs. t a characteristics (v dd = 3.0 v, v m 5.5 v) operating ambient temperature t a ( ? c) 2 1.5 1 0.5 0 h bridge on-resistance r on1 ( ? ) when operating during standby v ih v ih v il v il when operating during standby
data sheet s15301ej1v0ds 11 pd168102 characteristics curves r on2 (ch 5, ch 6) vs. v m characteristics (v dd = 3.0 v, t a = 25 ? c) motor supply voltage v m (v) 2 1.5 0.5 1 0246 h bridge on resistance r on2 ( ? ) r on2 (ch 5, ch 6) vs. t a characteristics (v dd = 3.0 v, v m = 5.5 v) operating ambient temperature t a ( ? c) 3 1.5 1 0.5 0 0 20 40 60 80 100 20 h bridge on resistance r on2 ( ? ) r ind vs. t a characteristics (v dd = v m = 3.0 v) operating ambient temperature t a ( ? c) 150 100 50 0 20 080 40 100 60 input pull-down resistance r ind (k ? ) v dds vs. t a characteristics (v dd = v m = 3.0 v) operating ambient temperature t a ( ? c) 2 1.5 1 0.5 0 02040 20 20 60 80 100 246 02460 detection voltage at low voltage v dds (v) t on , t off vs. v m characteristics (v m = 2.5 v, t a = 25 ? c) motor supply voltage v m (v) 2 1.5 1 0.5 0 output turn on/off time t on , t off ( s) t on , t off vs. v dd characteristics (v m = 2.7 v, t a = 25 ? c) supply voltage v dd (v) 1 1.5 1 0.5 0 output turn on/off time t on , t off ( s) t on t on t off t off
data sheet s15301ej1v0ds pd168102 12 characteristics curves t r , t f vs. v m characteristics (v dd = 2.5v, t a = 25 ? c) motor supply voltage v m (v) 1 0.8 0.6 0.4 0.2 1 0.8 0.6 0.4 0.2 0246 rise/fall time t r , t f ( s) t r , t f vs. v dd characteristics (v m = 2.7 v, t a = 25 ? c) supply voltage v dd (v) 0 0246 rise/fall time t r , t f ( s) t r t f t f t r
data sheet s15301ej1v0ds 13 pd168102 package drawing p 0.08min. 0.08min. lp s s b a b y1 s s f x4 a s y b s t x4 c2 a c a2 a1 note "t" and "f" excludes mold flash c1 b1 b a e p d d/2 /2 4 ? c0.5 36 25 112 37 24 48 13 hd hd ze zd e e /2 /2 he he d e f hd he t a a1 a2 b b1 c c1 c2 e lp x y y1 zd ze 0.64 0.23 0.05 0.50 0.05 0.08 0.10 0.625 0.625 0.20 0.03 0.14 0.16 item millimeters 0.17 0.40 0.10 0.14 0.20 6.75 6.75 0.20 7.00 7.00 0.20 0.67 0.03 p48k9-50-5b4 48-pin plastic wqfn (7x7) part terminal section detail of s x b m b a + 0.08 ? 0.04 + 0.02 ? 0.025
data sheet s15301ej1v0ds pd168102 14 recommended soldering conditions the pd168102 should be soldered and mounted under the following recommended conditions. for details of the recommended soldering conditions, refer to the document semiconductor device mounting technology manual (c10535e) . for soldering methods and conditions other than those recommended below, contact an nec sales representative. surface mounting type soldering conditions soldering method soldering conditions recommended condition symbol infrared reflow package peak temperature: 260 c, time: 60 seconds max. (at 220 c or higher), count: three times or less, exposure limit: 3 days note (after that, prebake at 125 c for 10 hours), flux: rosin-based flux with low chlorine content (chlorine 0.2 wt% or below) is recommended ir60-103-3 note after opening the dry pack, store it at 25 c or less and 65% rh or less for the allowable storage period. caution do not use different soldering methods together (except for partial heating).
data sheet s15301ej1v0ds 15 pd168102 notes for cmos devices 1 precaution against esd for semiconductors note: strong electric field, when exposed to a mos device, can cause destruction of the gate oxide and ultimately degrade the device operation. steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. environmental control must be adequate. when it is dry, humidifier should be used. it is recommended to avoid using insulators that easily build static electricity. semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. all test and measurement tools including work bench and floor should be grounded. the operator should be grounded using wrist strap. semiconductor devices must not be touched with bare hands. similar precautions need to be taken for pw boards with semiconductor devices on it. 2 handling of unused input pins for cmos note: no connection for cmos device inputs can be cause of malfunction. if no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. cmos devices behave differently than bipolar or nmos devices. input levels of cmos devices must be fixed high or low by using a pull-up or pull-down circuitry. each unused pin should be connected to v dd or gnd with a resistor, if it is considered to have a possibility of being an output pin. all handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 status before initialization of mos devices note: power-on does not necessarily define initial status of mos device. production process of mos does not define the initial operation status of the device. immediately after the power source is turned on, the devices with reset function have not yet been initialized. hence, power-on does not guarantee out-pin levels, i/o settings or contents of registers. device is not initialized until the reset signal is received. reset operation must be executed immediately after power-on for devices having reset function.
m8e 00. 4 the information in this document is current as of february, 2002. the inform ation is subject to change without notice. for actual design-in, refer to the latest publications of nec's data sheets or data books, etc., for the most up-to-date specifications of nec semiconductor products. not all products and/or types are available in every country. please check with an nec sales representative for availability and additional information. no part of this document may be copied or reproduced in any form or by any means without prior written consent of nec. nec assumes no responsibility for any errors that may appear in this docu ment. nec does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of nec semiconductor products listed in this document or any other liability arising from the use of such products. no license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual pr operty rights of nec or others. descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. the incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of cust omer. nec assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. while nec endeavours to enhance the quality, reliability and safety of nec semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. to minimize risks of damage to property or injury (including death) to persons arising from defects in nec semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. nec semiconductor products are classified into the following three quality grades: "standard", "special" and "specific". the "specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. the recommended applications of a semiconductor product depend on its quality grade, as indicated below. customers must check the quality grade of each semiconductor product before using it in a particular application. "standard": computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "special": transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "specific": aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. the quality grade of nec semiconductor products is "standard" unless otherwise expressly specified in nec's data sheets or data books, etc. if cust omers wish to use nec semiconductor products in applications not intended by nec, they must contact an nec sales representative in advance to determine nec's willingness to support a given application. (note) (1) "nec" as used in this statement means nec corporation and also includes its majority-owned subsidiaries. (2) "nec semiconductor products" means any semiconductor product developed or manufactured by or for nec (as defined above). ? ? ? ? ? ?

▲Up To Search▲

Price & Availability of UPD168102K9-5B4

	To Download UPD168102K9-5B4 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .